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In recent years, the automotive industry has been undergoing a significant transformation as it shifts towards centralized electric/electronic (EE) architecturesThis fundamental change is poised to reshape the strategic initiatives and product development strategies of automobile manufacturers along with their supply chains over the next decadeWith an increasing focus on integrating advanced functionalities into a single system-on-chip (SoC) or multi-chip designs, both OEMs and suppliers are exploring ways to consolidate operations, enhancing efficiency and safety in vehicles.
The landscape began to shift noticeably a few years agoIn 2021, industry leaders such as Christophe Marnat, Vice President of ZF’s Electronics and ADAS Products, highlighted that OEMs were beginning to seriously consider centralized architecturesJoining this trend, Bosch and Qualcomm recently revealed collaborations aimed at providing centralized computing modules within a single SoCThese modules are aimed to host critical applications for in-car digital cockpits (known as In-Vehicle Infotainment or IVI) and Advanced Driver Assistance Systems (ADAS), leveraging platforms like Qualcomm’s Snapdragon Ride Flex SoC, specifically designed to efficiently support mixed-criticality workloads.
The transition from distributed electronic control units (ECUs) and domain-based architectures to centralized EE frameworks is bringing tectonic shifts within the automotive sectorThis integration enables high-level applications for processing ADAS systems as well as infotainment functionalities on the same platform, presenting a new frontier of engineering ingenuity.
Centralized architectures are paving the way for the next generation of SoCs which are touted to be more integrated, smart, and efficientThe transition not only offers a robust solution for embedding seeing, thinking, and acting capabilities into vehicles but also enhances the user experience through better performance and decreased latencies in general operations.
This evolution signifies a structural shift in how automobile companies conceptualize their product offerings
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Moving to centralized regions means that hardware systems and the software stack will be redesignedThis new paradigm will feature a primary centralized computing module responsible for multiple functionalities, including crucial ADAS, higher levels of automation, IVI functionalities, and essential control mechanisms for chassis, body, and powertrains—all integrated into a unified system.
The advent of centralized EE architectures creates next-level SoCs characterized by enhanced integration levels, leveraging powerful processing capabilities mandated by the integration of artificial intelligence into more interconnected and feature-rich applicationsThe design of these advanced systems relies heavily on automotive-grade interfaces and processor intellectual properties (IPs), aiming for an increasingly sophisticated landscape for automotive electronics.
Integrating various car applications into a single SoC presents numerous advantagesBy combining functionalities such as ADAS and IVI, automobile manufacturers are addressing the simultaneous requirements for real-time processing mandates that these applications demandFor instance, ADAS applications such as Automated Emergency Braking (AEB) or Adaptive Cruise Control need rapid data processing, whereas IVI functionalities might serve high-resolution displays and infotainment options, all requiring streamlined processing power for smooth performance.
The intelligent distribution of applications within a centralized architecture not only allows manufacturers to achieve more consistency across their offerings but also fosters disparate processing capabilities, enabling new access and opportunities for hardware and software vendors alikeFor example, merging telematics functions with ADAS showcases how functions can be effectively integrated into distinct operational units without compromising performance or safety.
Given the demands of next-generation automobiles, which encapsulate both high-performance credentials and stringent safety regulations, the design of centralized computing SoCs will necessitate a robust framework
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These next-gen modules must support high levels of AI processing power along with multiple high-performance cores and display processing capabilities while maintaining lower latency and bandwidth usage.
One of the defining aspects of these SoCs is that they must manage vast amounts of real-time sensor data—integrating inputs from radars, LIDAR systems, ultrasonic sensors, and cameras—all of which necessitate data delivery with minimal delayThe growing complexity of vehicle data networks typically employs a combination of automotive-grade Ethernet, direct MIPI links for imaging sensors, and traditional Controller Area Network (CAN) systems to route information efficientlyGiven the massive data throughput required by radar and LIDAR running through Ethernet, standards such as the IEEE Time-Sensitive Networking (TSN) are critical to ensuring that safety-critical data is processed without interference from lower priority, less essential streams.
To integrate imaging data effectively within challenging in-vehicle conditions, the market has seen the introduction of proprietary protocols geared toward fulfilling these specific needsThe MIPI A-PHY, an emerging data transmission standard, has gained traction in the automotive space for effectively delivering image data to centralized computing systems.
As the demand arises for centralized SoCs capable of running multiple real-time applications, these modules will increasingly rely on virtualization techniques akin to those seen in high-performance data center environmentsGiven the need for sophisticated applications, the software stack will require optimization for next-generation RISC-V based automotive processors, ultimately paving the way for software-defined vehiclesForward-looking strategies will focus on harmonizing the integration of performance, safety, and AI processing into a cohesive whole.
A distinctive feature of centralized SoCs is their scalable heterogeneous multi-core processors
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By leveraging designs that allow for the integration of up to 12 64-bit application processors, automotive manufacturers aim to enhance both development efficiency and performance metricsKey industry players, including Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm, have collaborated to form a joint venture named QuintaurisThis initiative seeks to schema a unified RISC-V architecture to streamline compliance across automotive systems.
These centralized processing units will also include dedicated functional safety management modules, responding to the extremely high safety demands where failures cannot be toleratedTo bolster security measures, complete sets of connectivity interfaces are included, linking SoCs to the in-vehicle area networks and ensuring a reliable communication framework that includes pervasive use of protocols like PCI Express for extending compute capabilities with multiple accelerators.
Considering the demands posed by integrating multiple ADAS/IVI applications, the central computing module must undergo sophisticated manufacturing processes, leveraging advanced semiconductor FinFET technologyWith the automotive industry exploring the strategies for 3-nanometer process nodes, stakeholders are eager to capitalize on these advancements for future-proofed vehicle architectures.
The future of the automotive industry seems to be converging towards a robust vision of centralized computing units interfacing via UCIe multi-chip solutions, combining disparate functionalities while maximizing efficiencyThis pooling allows for a best-in-class approach for each functional chip, guaranteeing a cohesive yet flexible product management landscape that shortens time-to-marketAll the while, the UCIe protocol guarantees interoperability across designs, minimizing risks associated with joint hardware endeavors.
In conclusion, as developers work diligently to meet the rigorous demands of next-generation automotive electronic architectures, the integration of ADAS and IVI applications becomes paramount in a centralized framework fortified by automotive-grade IP
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